Dispensing means reinforcing the processor by applying a layer of adhesive after the processor is mounted on the mainboard. Generally speaking, processors on desktop computers are installed by aligning pins and pressing firmly into place. However, the solder joints between a smartphone processor and its mainboard are not 100% reliable. If the phone suffers impact or drop, the processor may become loose from the mainboard and trigger malfunctions. Dispensing with dispensing equipment serves as an extra safeguard. Simply put, smartphone chip dispensing is applying adhesive onto the processor. The technology has certain technical barriers, yet it is not as sophisticated as many people imagine.

So is dispensing necessary for smartphone chips?

Most smartphones available on the market adopt chip dispensing. The reason is straightforward: dispensing technology is mature and low-cost. Investing in dispensing equipment adds an extra safety guarantee, benefiting both manufacturers and end users. It stabilizes product quality, improves brand reputation and cuts after-sales costs. Smartphone chip dispensing generally targets four designated positions on the chip. Manufacturers can customize modules from dispensing machine suppliers and equip dispensing equipment to realize fully automatic mechanical dispensing, eliminating errors caused by manual dispensing.

Dispensing brings multiple advantages for smartphones:

1. Chip Position Securing: Adhesive firmly fixes chips onto the PCB (Printed Circuit Board) and prevents loosening caused by mechanical vibration or temperature fluctuation. Fixing chips in position maintains stable and reliable circuit connections.

2. Heat Dissipation: Dispensing creates favorable contact between chips and PCB to boost heat dissipation efficiency. Smartphone chips generate heat during operation. Efficient heat dissipation prevents performance degradation or permanent damage induced by overheating.

3. Oxidation and Corrosion Resistance: The dispensed adhesive forms a sealed protective layer between chips and PCB, isolating solder joints from air and moisture to mitigate oxidation, corrosion and component failure.

4. Electromagnetic Interference Suppression: Dispensing reduces electromagnetic interference around chips, strengthens the anti-interference capability of the whole smartphone system and ensures stable operation.

5. Environmental Protection: The adhesive barrier blocks dust, moisture and other external contaminants from entering gaps between chips and circuits, improving smartphone reliability and service life.

In summary, dispensing plays vital roles in smartphone chip assembly, including component securing, heat dissipation, corrosion prevention, electromagnetic interference resistance and environmental protection.