Glue dispensing refers to reinforcing the processor with a layer of adhesive after installation on the motherboard. Generally speaking, when installing a processor on a desktop computer, it is necessary to align the pins and press them firmly. But on mobile phones, the soldering between the processor and motherboard is not 100% reliable. When the phone collides or falls, the motherboard and processor may loosen, causing problems with the phone. Using dispensing equipment for dispensing is equivalent to adding another layer of security. Yes, to put it simply, mobile phone glue dispensing technology is to apply a layer of glue to the processor. Technically, it is not without barriers, but it is not as advanced as we imagine.

So, should we glue the phone chips specifically?

Most of the mobile phones on the market now undergo chip dispensing processing. The reason is simple: the dispensing technology is not complicated and the cost is not high. Buying a dispensing equipment is equivalent to having multiple layers of insurance, which is good for both users and oneself. Product quality is more stable, which not only improves brand reputation but also reduces subsequent after-sales costs. Mobile phone glue is actually applied to four points on the chip. As long as you customize a module from the dispensing machine manufacturer and purchase a dispensing machine, you can completely rely on mechanical dispensing processing to avoid errors caused by manual dispensing.

At the same time, there are some benefits to dispensing glue on mobile phones:

1. Fixed chip position: Glue can firmly fix the chip on the PCB (Printed Circuit Board), preventing the chip from loosening due to mechanical vibration or temperature changes. Fixing the chip in the correct position helps maintain the stability and reliability of circuit connections.

2. Heat dissipation: Glue dispensing can help establish good contact between chips and PCBs, improving heat dissipation efficiency. When the mobile phone chip is working, it generates a certain amount of heat, and effective heat dissipation can prevent the chip from overheating and causing performance problems or damage.

3. Preventing oxidation and corrosion: Glue can form a sealed protective layer between the chip and PCB, preventing air and moisture from contacting the chip solder joints, thereby reducing oxidation, corrosion, and damage to the chip.

4. Preventing electromagnetic interference: Glue dispensing can also reduce electromagnetic interference around the chip, improve the anti-interference ability of the entire mobile phone system, and ensure the normal operation of the phone.

5. Preventing external environmental influences: Glue dispensing can to some extent prevent dust, moisture, and other external pollutants from entering the gaps between chips and circuits, thereby increasing the reliability and lifespan of mobile phones.

In summary, glue plays an important role in the assembly of mobile phone chips, including stable fixation, heat dissipation, corrosion prevention, anti-interference, and protection.