English
English

SMT, semiconductor industry applications

SMT, semiconductor industry applications

PCB点红胶

PCB点红胶

工艺要求：红胶单点分配，点径0.3-0.8mm

胶水：富NE8800K、富士NE7300H

元件包封

元件包封

工艺：芯片包封、元器件包封

胶水：乐泰9060F、乐泰3542、富乐UV EA6040D