Process requirements: Dot diameter 3.5–3.6 mm, height 1.1–1.2 mm, flat rounded profile

Adhesive: KMT KMT-0887S

Typical customers：TCL, MLS, Cree, HKC, Guozhi, etc

Adhesive: Silicone optical adhesive GH1030 (White)

Process requirements:Large single dot jetting to encapsulate IC for IC protection and securing