MiniLED applications

MiniLED applications

MiniLED Backlight Application

MiniLED Backlight Application

Technological requirements:Point diameter3.5mm-3.6mm,height1.1-1.2mm,flat arc shape。

Glue:Kangmei TeKMT-0887S

Typical Customers:TCL、Mu Linsen, Ke Rui, Hua Xing, State owned Assets, etc

IC surface encapsulation

IC surface encapsulation

Glue:Organic silicon optical adhesive GH1030 (white)

Technological requirements:Single point spraying, coating IC, protecting and fixing IC