Several examples are given regarding the application scope of automatic dispensing in the chip packaging industry:

Firstly, the application of automatic dispensing in chip bonding

PCB boards that are prone to displacement during the adhesive process can easily cause electronic components to fall off or shift from the surface of the PCB board. To address this issue, we can use an automatic dispensing device to apply glue to the surface of the PCB board, and then place the board in an oven to heat and solidify. This way, electronic components can be firmly attached to the PCB.

Secondly, the application of automatic dispensing and filling of bottom materials

I believe many technicians who have used automatic dispensing have encountered similar difficulties. During the flip chip process, it is difficult to bond due to the smaller fixed area compared to the chip area; In such a situation, if the chip is impacted or undergoes thermal expansion, it is easy to cause the bumps to break, causing the chip to lose its expected performance.

To better solve similar problems, McDot suggests injecting organic glue into the gaps between the chip and substrate through automatic dispensing, and then curing it. Under such automatic dispensing operation, the connection area between the chip and the substrate can be effectively increased, and the bonding strength between the chip and the substrate can be strengthened, providing good protection for the chip bumps.

Thirdly, the application of automatic dispensing surface coating

After the chip completes the soldering operation, a layer of low viscosity and good flowability epoxy resin can be automatically applied and cured between the chip and the solder joints. This not only elevates the appearance of the chip, but also provides protection against external erosion and stimulation, which can extend the service life of the chip!